First Embodiment
FIG. 1 shows a cable clamp 1 according to a first embodiment of the present invention. The cable clamp 1 is installed on a printed wiring board 20 in order to hold cables 21 , 21 , . . . at predetermined positions on the printed wiring board (printed substrate) 20 .
This cable clamp 1 includes a substantially U-shaped cable holding part 11 for holding the above cables 21 , 21 , . . . , an opening and closing part 12 for opening and closing the cable holding part 11 , and a part to be soldered 13 to the foot prints 23 or the like of the printed wiring board 20 .
The above opening and closing part 12 is provided with a suction part 15 to be sucked by suction means 22 used to mount electronic parts (not shown) on the printed wiring board 20 . In this embodiment, the suction part 15 is formed on the flat surface of the opening and closing part 12 . This suction part 15 also serves as a lock part for locking the cables.
The above cable holding part 11 , the opening and closing part 12 , and the part to be soldered 13 are integrally molded out of a solderable metal, for example, a copper alloy.
The cable clamp 1 is formed like a substantially rectangular frame. The above part to be soldered 13 constitutes the bottom of the cable holding part 11 . The opening and closing part 12 and the part to be soldered 13 are arranged on opposite sides of the cable holding part 11 .
The above opening and closing part 12 is connected to one side 11 a of the cable holding part 11 by a hinge 14 . Thereby, the opening and closing part 12 can be opened or closed through the hinge 14 .
A lock part 11 c projecting sideways is provided at the upper end of the other side 11 b of the cable holding part 11 . A hook part 12 a to be locked to the lock part 11 c is provided on the free end side of the opening and closing part 12 .
By opening the opening and closing part 12 , the cables 21 can be easily held in the cable holding part 11 . By locking the hook part 12 a with the lock part 11 c , the opening and closing part 12 can be prevented from being opened accidentally.
A large number of the cable clamps 1 are carried by a carrier tape 30 as conveyor devices as shown in FIG. 3. The carrier tape 30 has a prolonged storing part 31 having a U-shaped section, collar parts 32 and 32 extending sideways from the ends of both sides of the storing part 31 , and a removable cover 33 for covering the opening 37 of the storing part 31 .
The storing part 31 is partitioned into a large number of chambers 35 by partition parts 34 provided at predetermined intervals. A large number of conveyance holes 36 are formed in the collar parts 32 and the cover 33 .
When the cable clamp 1 is stored in the carrier tape 30 , the suction part 15 of the opening and closing part 12 is exposed outward from the opening 37 of the storing part 31 . The part to be soldered 13 is opposed to the bottom of the storing part 31 .
The height H 1 from the opening and closing part 12 to the part to be soldered 13 of the cable clamp 1 is set slightly smaller than the depth H 2 of the storing part 31 of the carrier tape 30 .
To install the cable clamp 1 on the printed wiring board 20 , the carrier tape 30 is carried to a predetermined position while the large number of cable clamps 1 are stored in the carrier tape 30 . The cover 33 of the carrier tape 30 is then removed.
Then, the suction part 15 of the opening and closing part 12 of the cable clamp 1 at the head of the cable clamps 1 carried by the carrier tape 30 is sucked by the suction means 22 (see FIG. 1) for mounting electronic parts on the printed wiring board 20 , and moved to a predetermined position on the printed wiring board 20 .
The printed wiring board 20 is provided with foot prints (solder) 23 and 23 at positions where the cable clamp 1 should be installed. The cable clamp 1 is provisionally installed in such a manner that both sides of the part to be soldered 13 are brought into abut with the respective foot prints 23 and 23 .
After predetermined electronic parts (not shown) and the cable clamps 1 , 1 , . . . are provisionally installed on the printed wiring board 20 likewise, the electronic parts and the cable clamps 1 , 1 , . . . are soldered to the printed wiring board 20 in a reflow furnace.
Thus, the suction part 15 of the cable clamp 1 according to the present invention can be sucked by the suction means 22 used to mount electronic parts on the printed wiring board 20 . Further, the part to be soldered 13 can be also soldered to the printed wiring board 20 .
Therefore, the cable clamp 1 according to the present invention can be automatically installed on the printed wiring board 20 by an automatic assembly machine for electronic parts. At this time, it is not necessary to form a hole in the printed wiring board 20 .
Therefore, a reduction in the part mounting area of the printed wiring board 20 and a reduction in the degree of freedom of designing the wiring pattern of the printed wiring board 20 can be suppressed.
Since the cable clamp 1 according to the present invention can be soldered to be securely fixed to the printed wiring board 20 and does not turn, it is possible to prevent the cable clamp 1 from interfering with another mounted part adjacent to the cable clamp 1 and from being installed in a direction different from that intended by the designer and to hold the cable 21 such as an electric wire or optical fiber in a right direction.
Further, the cable clamp 1 can be installed on the printed wiring board 20 by an automatic assembly machine as in the case of installing electronic parts, the efficiency of installation work can be improved and a mistake such as that a worker fails to install the cable clamp can be prevented.
The above opening and closing part 12 can be made of an elastic material, which makes it possible to open and close the opening and closing part 12 easily.
The above opening and closing part 12 may also be made of a plastic deformable material which can change its shape, which makes it possible to open and close the opening and closing part 12 easily.
Second Embodiment
FIG. 4 shows a cable clamp 40 according to a second embodiment of the present invention. In the following description, the same parts as in the cable clamp 1 of the above first embodiment are given the same reference symbols and their detailed descriptions are omitted.
The cable clamp 40 has a substantially U-shaped cable holding part 11 , an opening and closing part 12 , and a part to be soldered 41 . A lock part 11 c is provided on the other side 11 b of the cable holding part 11 . A flat suction part 15 is provided on the top surface of the opening and closing part 12 . A hook part 12 a is provided on the free end side of the opening and closing part 12 .
A hole 42 having a predetermined size is formed in the part to be soldered 41 . In this embodiment, the relatively long elliptic hole 42 is formed in the longitudinal direction of the rectangular part to be soldered 41 .
When the part to be soldered 41 of the cable clamp 40 according to the present invention is soldered to the foot print 23 on the printed wiring board 20 , heat applied to the part to be soldered 41 readily spreads to the entire part to be soldered 41 , thereby making it possible to carry out soldering securely in a short period of time.
Third Embodiment
FIG. 5 shows a cable clamp 50 according to a third embodiment of the present invention. The cable clamp 50 has a cable holding part 51 , an opening and closing part 12 , and parts to be soldered 52 and 52 . A suction part 15 is provided on the flat top surface of the opening and closing part 12 .
The parts to be soldered 52 and 52 project sideways from the both sides of the bottom 53 of the cable holding part 51 .
The above cable holding part 51 is made of a resin which can be resistant to the inside temperature of a reflow soldering apparatus. The parts to be soldered 52 and 52 are formed like a lead, and made of a metal which can be soldered. The parts to be soldered 52 and 52 are integrated with the cable holding part 51 by insert molding.
An lock hole 51 c is formed in the other side 51 b of the above cable holding part 51 as shown in FIG. 6. An lock piece 12 b to be engaged with the engagement hole 51 c is provided on the free end side of the above opening and closing part 12 .
Most part of the cable clamp 50 is made of a resin to make its molding easy. The parts to be soldered 52 and 52 are formed like a lead to reduce the size of the foot prints 23 of the printed wiring board 20 . Therefore, the degree of freedom of designing the printed wiring board increases.
Others
The disclosures of Japanese patent application No.JP2005-364687 filed on Dec. 19, 2005 including the specification, drawings and abstract are incorporated herein by reference.
本文转自：China Industry News